Process

Conditions

Stir Mixing

Main agent: 80/hardener: 20 (weight ratio)

20min

Hold time

15min

Coating

90~120 mesh

30~35mm(wet film)

Hold time

15min

10~20 min

Pre-cure

One side each coating backing:
First side: hot air convection oven (70-75/15~20min)
Back side: hot air convection oven(70-75/25~30 min)
Both side simultaneous coating backing:
Hot air convection oven(70-75/30~45min)

70-75/20 + 5 min
70-75/30 + 5 min
70-75/30~45 min

Exposure

400 + 50 mj/cm²(lightgreen, yellow)
550 + 50 mj/cm²(blue,red and dark green)
600 + 50 mj/cm²(white)
900 mj/cm²(black)

11 step~21 step (Kodak No. 2)

Hold time

10 min

10~20 min

Development

Aqueous alkaline solution: 1 wt% Na2CO³
Temperature of developers:32
Spray pressure: 2.5 kg/cm²
Developing time: 60 seconds

32+ 1
2.0~30 kg/cm²
60~90 seconds

Rinsing and dry

Temperature of rinsing water:25
Spray pressure:2.0 kg/cm²
Rinsing time:45 seconds

 30
1.5~205 kg/cm²
45~60 seconds

Post cure

Hot air convention oven:a. 150/60min
b.150/60min150ˆ/60min

(NONE PLUG IN)
(PLUG IN)

As to the operation environment, it is desirable to deal with the ink under the yellow lamps in the clean room, Room temperature,20,25, Room humidity 60, RH Please avoid using it directly or indirectly under white fluorescent lamps or sun ligth.

The main agent and hardener must mix evently, then apply also the given hold time.less holding time possibly cause the low tackiness and may cause scum.

The adequate thickness is 20, 25  m(on the copper after curing). Thin coating possibly reduces its solder heat resistance. (the min thickness is 10mm) On the ither hand, thick coating possibly cause the under cut.

During the printing process, if the ink blocks the hole, this may cause scum.

Pre-cure ar 72 + 3. insufficient dryness causes tackiness and loss of gloss.

Exposure energy depends may increase development time or cause scum.

Regarding to the development process, please control the developer density, the temperature, the spray pressure and thre developing time etc. The inadequacy of the control causes the degradation of the ability to development.

Setting of the post cure condition for solder mask will vary with the curing condition of marking ink. Insufficient curing cause peeling and over curing may cause the degradation of properties with regard to electroless gold plating.

During electroless gold plating process, therd are two ways of printing mark ink after post curing.

150/60 min electroless gold plating mark printed.

150/30 min mark printed 150/30 min electroless gold plating.